Question: Creep-thinfilms substrate 

Forum: MEMS Packaging Forum
Date: 2005, Jun 04
From: NJ <neerushanaj@yahoo.com.sg>

Has anyone done Creep tests on thin film-substrate samples, using 3 point bending? I am planning on designing a rig to do such a test? Please give me feedback or concerns pertinent to such a test? In terms of design and the test it self? Pls reply ASAP. Thank you.

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