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Hi, everybody,
I have been using SU-8-2050 on glass in these months.
But, the profile of it was so bad, especially, there was
some rubbish SU-8 parts at the bottom of the profile, and the width became 10 um wider than that of photomask (50 um).
You know,after spin coat, the thickness at the edge of the
substrate will become a little thicker than center part.
So a layer of air will exist between photomask and resist.
Is it the reason? How to solve it?
Also I want to ask you whether 100 s exposure is too long for
50 um thick resist, or not.
Thank you very much
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