Sporian Microsystems | MEMS Packaging Forum
 Sporian Microsystems: Products




Sporian Microsystems: Services



Forum
Next-in-Thread Next Message

Question More details on the Tepla approach, please. 

Forum: SU-8 Photoresist Discussion Forum
Re: None SU8 -Removal (sarang)
Re: News SU8-Removal
Date: 2002, May 06
From: Brian

Hello Tepla:

Can you give us some more details on your approach? Is there a journal or conference paper or even a magazine article or web page you can reference?

Does it work for layers of arbitrary thickness?

Does it depend on processing history?

What temperatures, gases, etc. are required?

How are the results? Is there any residue remaining?

What is the rate of material removal?

Sorry to ask so many questions, but if the process and results are accessible and good this could solve a problem for a lot of people.

Thanks, Brian

Next-in-Thread Next Message

Messages Inline: 1 All Outline: 1 2 3

1. Feedback TePla Work to Date. More information is available. by Hank Gilbert, 2003, Mar 26

Add Message to: "More details on the Tepla approach, please."

Register Subscribe Admin Mode Show Frames Search Help for Discussion Forum 1.10

Terms of Use | Privacy Policy | Site Map | Related MEMS Links | Search this Site

Copyright Sporian Microsystems