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I am Using "UV Photo-Lithography Process" using SU8 as Photo-resists.
I am using St.Steel Substrate Instead of Silicon Wafer & coating a thin layer of nickel on St.Steel substrate. After that spin coating St.Steel sample with Negative Photo-Resists (SU8 2075) & Exposing with UV light & develpoing in SU8 Developer. After Developing i can see the patterns on St.steel ring but when i rinsed with water , Patterns settled down in Developer solution. IS this due to Improper SU8 Bonding? Shall i use Less Viscous SU8 instead of SU8- 2075. ? i am following the cycle times applicable for Silcion Wafers, is that affect in bonding problem? shall i Soft bake for more time? Regards,
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