Sporian Microsystems | MEMS Packaging Forum
 Sporian Microsystems: Products




Sporian Microsystems: Services



Forum
Next-in-Thread Next Message

None Research Associate 

Forum: SU-8 Photoresist Discussion Forum
Re: Question Bonding with SU8 (J)
Date: 2005, Sep 26
From: Eric Hullander <hullandered@ornl.gov>

Hi,

I bond a crosslinked SU-8 substrate to an unexposed Su-8 layer to make sealed ufluidic channels. It's easy once you get the hang of it. This technique was borrowed from Rebecca Jackman from MIT. She has a couple of good papers out describing the process. My substrate is 10um thick and my sealing layer is 5um thick. Jackman uses much thicker resists, but my temperature are the same.

Eric

Next-in-Thread Next Message

Messages Inline: 1 All Outline: 1 2 3

Add Message to: "Research Associate"

Register Subscribe Admin Mode Show Frames Search Help for Discussion Forum 1.10

Terms of Use | Privacy Policy | Site Map | Related MEMS Links | Search this Site

Copyright Sporian Microsystems