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I have not used SU-8 as a master for microembossing, but I have a few thoughts for you.
It seems you may have 2 options to use the SU-8 in your application. If your embossing will be done at lower temperatures, you may be able to use the SU-8 directly. I don't know what "lower" means here - it will depend on the hardness of your embossed material at the embossing temperature relative to the hardness of the SU-8 at that temperature. If the SU-8 is so soft at your embossing temperature that it is deformed an "unacceptable" amount by the embossing process, you can use the SU-8 to make a metal mold. Then this metal mold can be used as your embossing master. I have made metal molds from SU-8 patterns by electroplating both nickel and copper. The SU-8 is then removed from the metal mold. Feature sizes and aspect ratios are then determined by the capabilities of the SU-8. You can check http://daytona.ca.sandia.gov/LIGA/pdfs/su8_wet.pdf and http://daytona.ca.sandia.gov/LIGA/pdfs/su8_dry.pdf for info on removing the SU-8 from the mold. Good luck to you. Richard Gray
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