Dear SU-8/MEMS community,
Over the last couple of years PVA-TePla America, Inc. in join venture with PVA-TePla AG in Germany has been able to develop a MW plasma process for successfully removing applied SU-8 layers.
During internal tests etch rates of up 1 micron/min were established depending on the applied thickness (up to 650 microns) and types of SU-8. SU-8 layers were used for surrounding and supporting “high” microstructures, which must be removed before additional process steps could be applied. The SU-8 was always directly exposed to the plasma – no sacrificial layers!!
Several analytical investigations carried out on different sample types revealed that the structure conditions like surface topography; structure dimensions, etc. were nearly unchanged by MW plasma.
At this point in time PVA-TePla continues investigating and evaluating the use of MW-Plasma for SU-8 removal. In addition investigations are on its way for developing a SU-8 batch process. Currently wafers can be processed individually.
PVA-TePla America, Inc. is more than happy to evaluate your SU-8 sample for you. For more information or demonstration arrangements, please contact:
PVA-TePla America, Inc.
1550 Norwood Drive, Suite 307
Hurst, Texas 76054
Attn.: Karsten Mausolf, Dipl.-Ing., (Process Engineer)