One of Sporian Microsystems’ primary strengths is its ability to provide novel, yet cost effective and manufacturable, MEMS (Micro-Electromechanical Systems) and opto-electronics packaging solutions. While the MEMS devices themselves have matured significantly over the last decade to become commonplace products, packaging of these devices is a significant technical barrier, and has not been addressed thoroughly. Due to the extreme number of device types, of manufacturing technologies, of geometries and sensing/actuating concepts, MEMS packaging problems often require a significant level of customization. While opto-electronics packaging (the integration of optical, opto-electronic, and electronics components) includes a very wide range of established components, technologies, and applications, it too commonly requires a significant level of application specific customization. This customization can lead to the cost and effort for the packaging and interconnect outweighing the device/component cost by several orders of magnitude. Inefficient package design only makes this problem more severe. Visit our MEMS Packaging Forum for a full discussion of MEMS Packaging issues. Sporian has expertise in the following MEMS and opto-electronics packaging technologies: Optical Sensor Packaging Opto-Electronic Subassembly Design Flip Chip Passive Solder Self-Alignment Multi-Chip Modules - FCPs or MCMs

 
Sporian can selectively offer integrated research, design, and prototyping services relating to:

New Package Development and Prototyping
       Visit our MEMS Packaging Forum
Package Design, Modeling, and Layout
Consultation on Packaging Techniques and
       Technologies
Novel Packaging Solutions including Package
       Development and Prototyping
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