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MEMS Company Expands Scope of Sensor Fusion Efforts
Posted on Saturday, July 26 @ 19:25:18 EDT by Calin

MEMS Boulder, CO (July 22, 2003) - The U.S. Navy announced Sporian Microsystems, Inc. [profile] was awarded a contract to develop a MEMS (micro-electro-mechanical-system) sensor that will be used to monitor and evaluate the condition of aerospace systems. The contract is sponsored by the U.S. Navy at China Lake, CA through the Trident Program and will extend into 2004.



The sensor being developed under this contract will utilize Sporian
Microsystems’ unique technologies regarding MEMS, optics, and
microelectronics packaging. The sensor is expected to incorporate
technologies that measure temperature, mechanical shock, humidity, and
strain all in a single microelectronics package. “We are very excited
to expand our sensing capabilities under this contract and be given the
opportunity to add a strain sensor to our existing repertoire of sensing
parameters”, said Sporian project lead Kevin Harsh.

The contract will be performed through a partnership among Sporian
Microsystems, Lockheed Martin of Eagan, MN, and Boulder based Photonport
Technologies. “We are very fortunate to bring together such a
well-rounded team with expertise in specific areas that will contribute
to the overall success of this contract”, stated Sporian Microsystems’
VP of R&D, Wenge Zhang.

The project leverages Sporian Microsystems’ existing technologies and
expertise in measuring a wide range of conditions on a single,
integrated microelectronics device. Along with several additional
military applications, the company is targeting commercial applications
in the packaging and shipping industry.

Sporian Microsystems was formed in 2000 as a R&D firm focused on areas
in MEMS, optics, and microelectronics packaging. More information about
Sporian Microsystems can be found at www.sporian.com.

For more information please contact:

Bill Garrett
bill@sporian.com
303.516.9075x11


 
Related Links
· More about MEMS
· News by Calin


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